Lumentum Industrial Laser Cutting Solutions

Application-specific laser processing configurations refined through thousands of production deployments. We match wavelength, power density, and beam characteristics to your material and throughput requirements.

Fiber laser cutting carbon steel sheet at Lumentum facility

Solution 01

Metal Sheet Cutting

Our flat-bed cutting systems process carbon steel up to 40mm, stainless steel up to 30mm, and aluminum up to 25mm with edge quality that eliminates secondary deburring operations. The LM-Series platform uses a Precitec auto-focus cutting head with automatic nozzle centering and real-time piercing detection to maintain consistent cut quality across production shifts.

Max Carbon Steel

40mm

Edge Roughness

Ra 3.2

Discuss Your Application

Lumentum laser systems for automotive body-in-white processing

Solution 02

Automotive Manufacturing

Automotive OEMs and tier-1 suppliers use Lumentum laser systems for body-in-white cutting, battery tray processing, and hydroformed tube trimming. Our systems integrate with existing FANUC and KUKA robotic cells through standardized EtherCAT interfaces. The high-brightness fiber laser source provides a 15% improvement in weld penetration depth compared to conventional diode-pumped sources at equivalent power levels.

Cycle Time Reduction

35%

Integration Time

3 Weeks

Request Application Review

Precision aerospace component laser processing by Lumentum systems

Solution 03

Aerospace Components

Aerospace fabricators require tolerances that commercial cutting systems cannot reliably achieve. Lumentum's LM-6000 and LM-20K platforms deliver ±0.003mm positioning accuracy on titanium, Inconel 718, and Hastelloy materials used in turbine blades, structural brackets, and heat shields. Our AS9100-compatible quality documentation includes full traceability from raw material to finished cut part.

Positioning

±0.003mm

Materials

Ti, Inconel

Schedule Evaluation

Semiconductor wafer dicing with Lumentum precision laser systems

Solution 04

Electronics & Semiconductor

Semiconductor packaging and PCB manufacturing demand micron-level processing control. Lumentum photonic modules provide the wavelength flexibility (355nm, 532nm, 1064nm) and pulse shaping required for wafer dicing, via drilling, and selective ablation. Our beam delivery systems maintain M-squared values below 1.1 across the full operating envelope, ensuring consistent feature dimensions even at high throughput rates.

Beam Quality (M²)

<1.1

Wavelengths

3 Options

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Medical device stent laser cutting with Lumentum systems

Solution 05

Medical Device Fabrication

Medical device manufacturers choose Lumentum for stent cutting, catheter processing, and orthopedic implant fabrication where FDA 21 CFR Part 11 documentation requirements are non-negotiable. Our Class 1 enclosed systems with HEPA filtration and integrated fume extraction meet cleanroom compatibility standards. Post-process edge quality consistently achieves Ra 1.6 or better on nitinol and 316L stainless steel tubing.

Surface Roughness

Ra 1.6

Compliance

FDA

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Need a Custom Laser Processing Solution?

Send us your material samples and application requirements. Our engineers will run cutting trials in our applications laboratory and provide a detailed feasibility report at no charge.

Submit Application Details